Mochini oa ho Seha Laser ea Ceramic Substrate
Mochini oa ho Seha Laser ea Ceramic Substrate

Mochini oa ho Seha Laser ea Ceramic Substrate

Mochini oa Ceramic Substrate Laser Cutting Machine ke{0}}o sebetsa ka mokhoa o nepahetseng ka laser o phahameng o etselitsoeng ho seha lisebelisoa tse tsoetseng pele tsa letsopa tse sebelisoang ho elektronike, liphutheloana tsa semiconductor, limmojule tsa motlakase, le lisebelisoa tse ncha tsa matla. O sebelisa lebone la laser le tsepamisitsoeng hantle le taolo e nepahetseng ea ho sisinyeha, mochini o fana ka mathōko a hloekileng, bophara bo moqotetsane ba kerf, le ho nepahala ha maemo ntle le ho hlahisa khatello ea kelello.
Romela Inquiry

Kenyelletso ea Sehlahisoa

 

Mochini oa Ceramic Substrate Laser Cutting Machine ke{0}}o sebetsa ka mokhoa o nepahetseng ka laser o phahameng o etselitsoeng ho seha lisebelisoa tse tsoetseng pele tsa letsopa tse sebelisoang ho elektronike, liphutheloana tsa semiconductor, limmojule tsa motlakase, le lisebelisoa tse ncha tsa matla. O sebelisa lebone la laser le tsepamisitsoeng hantle le taolo e nepahetseng ea ho sisinyeha, mochini o fana ka mathōko a hloekileng, bophara bo moqotetsane ba kerf, le ho nepahala ha maemo ntle le ho hlahisa khatello ea kelello.

 

Ke hobane'ng ha U sebelisana le Chinasky Laser?

 

Tsebo ho Precision Ceramic Processing:Boiphihlelo bo pharalletseng ba ts'ebeliso ho li-substrates tsa ceramic, lisebelisoa tsa semiconductor, likarolo tsa elektroniki, le boenjiniere bo nepahetseng.


Tsebo e Tsoetseng Pele ea Tlhahiso:Felletse ka{{0}meralo ea ntlo, boqapi, nts'etsopele ea software, ho kopanya, le ho etsa liteko ho netefatsa boleng ba mochini o tsitsitseng.


Litharollo tsa Customized Processing:Litlhophiso tsa laser tse hlophisitsoeng, litsamaiso tsa motsamao, lisebelisoa, le tharollo ea boiketsetso li fumaneha bakeng sa lisebelisoa tse fapaneng tsa ceramic le litlhoko tsa tlhahiso.


Tšehetso ea Setsebi sa Theknoloji:Baenjineri ba rona ba fana ka tlhahlobo ea lisebelisoa, ntlafatso ea tšebetso, tataiso ea ho kenya, le thuso ea nako e telele- ea botekgeniki ho holisa tlhahiso e sebetsang hantle.

 

Litlhaloso tsa Tekheniki

 

Mohlala

HT{{0}PFC3030

Matla a laser

1000w

Laser wavelength

1060-1080nm

X/Y{0}}Axis Repositioning Accuracy

±5 um

Lebelo

5000-25000 limilimithara / s

Processing Range for Flat (L*W)

300*300mm/600*600mm

Max. Ho potlakisa

1G

Kakaretso Dimensions

1250*1250*1800mm

 

Likarolo tsa Ts'ebetso le Melemo

 

-Ho Seha Ceramic ho Hoholo:E hlahisa likarolo tse boreleli tse nang le sebopeho se setle haholo bakeng sa lits'ebetso tsa elektroniki tse nepahetseng.


Ha ho{{0}Tlhahiso ea Likhokahano:Ho itšeha ka laser ho felisa khatello ea kelello ea mochini, ho thibela deformation le ho atolosa ho tšepahala ha sehlahisoa.


Excellent Processing Flexibility:E loketse liprofaele tse rarahaneng, likoti tse nyane, li-slots, li-curve, le li-geometri tsa ceramic tse hlophisitsoeng.


Tlhahiso e Phahameng-:Maemo a potlakileng le taolo e bohlale ea motsamao e ntlafatsa tlhahiso ha o ntse o boloka boleng bo tsitsitseng ba ho itšeha.


Matlakala a Tlase:Moqomo oa laser kerf o thusa ho eketsa tšebeliso ea substrate le ho fokotsa litšenyehelo tsa tlhahiso.


Automation Ready:E ts'ehetsa ho jarolla ka bohona, ho beha pono, lits'ebetso tsa tlhahlobo, le kopanyo e bohlale ea tlhahiso.

 

Lisebelisoa tsa indasteri

 

Mochini oa Ceramic Substrate Laser Cutting Machine o etselitsoe ho seha ka nepo lirafshoa tse tsoetseng pele, lisebelisoa tse brittle le litšepe tse tšesaane. Ho se sebetse ha eona{1}}ka laser ho fokotsa sekhahla, ho fokotsa matla a mocheso, le ho fana ka lintlha tse nepahetseng haholo ho pholletsa le mefuta e mengata ea lisebelisoa tsa boenjiniere.

 

Advanced Technical Ceramics
E loketse bakeng sa ho sebetsa-lisebelisoa tse phahameng tsa letsopa tse sebelisoang ho semiconductor, lisebelisoa tsa motlakase, le liindasteri tsa ho paka tsa elektroniki, ho kenyeletsoa:

  • Alumina (Al₂O₃)
  • Aluminium Nitride (AlN)
  • Zirconia (ZrO₂)
  • Silicon Nitride (Si₃N₄)
  • Silicon Carbide (SiC)
  • Beryllium oxide (BeO)
  • DBC, DPC, le AMB Ceramic Substrates

 

Hard & Brittle Materials
Sistimi e nepahetseng ea laser e fana ka seha se hloekileng se nang le chipping e nyane bakeng sa lisebelisoa tse brittle tse sebelisoang hangata ho optoelectronics le tlhahiso e nepahetseng, ho kenyelletsa:

  • Sapphire
  • Khalase ea Optical
  • Quartz
  • Li-wafers tsa silicon
  • Polycrystalline Diamond (PCD)

 

Lisebelisoa tsa Metal tse Thin
Ntle le ts'ebetso ea ceramic, mochini o loketse ho seha ka nepo lipampiri tse tšesaane tse sebelisoang likopanong tsa elektroniki le likarolo tse nepahetseng, ho kenyelletsa:

  • Tšepe e se nang Mokelikeli (304 / 316L)
  • Koporo
  • Aluminium
  • Nickel-Titanium Alloy (Nitinol)
  • Lipampiri tse ling tsa Thin Precision Metal

 

Likopo tse Tloaelehileng tsa Indasteri
Mochini o sebelisoa haholo liindastering tse hlokang -sebelisoa ka mokhoa o nepahetseng, joalo ka:

  • Semiconductor Packaging
  • Matla a Elektronike
  • IGBT & Power Module Manufacturing
  • Tlhahiso ea Ceramic PCB
  • Likaroloana tsa Elektronike
  • Lisebelisoa tsa Optoelectronic
  • Lisebelisoa tsa Bongaka
  • Lisebelisoa tsa Precision
  • Patlisiso ea Mahlale
  • Tlhahiso e Ncha ea Matla

 

Tšebeletso ea Tlhahiso e Tloaelehileng

 

Kopo e 'ngoe le e' ngoe ea ts'ebetso ea ceramic e hloka ho nepahala ho fapaneng ho itšeha, ho lumellana ha thepa, le bokhoni ba tlhahiso. Chinasky Laser e fana ka lits'ebeletso tse feto-fetohang tsa maemo ho lumellana le litlhoko tsa hau tsa tlhahiso.

 

Tlhophiso ea Mohloli oa Laser:Litlhophiso tsa UV, tse tala, le fiber laser lia fumaneha ho ipapisitse le mofuta oa ceramic, botenya, le litlhoko tsa boleng ba ts'ebetso.


Sebaka sa Ts'ebetso se Khethiloeng:Mehaho e sebetsang e ka etsetsoa lichipisi tse nyane tsa ceramic,{0}}li-format substrates tse kholo, kapa{1}}mehala ea tlhahiso e phahameng.


Sistimi ea Positioning:Mekhoa ea boikhethelo ea CCD ea pono e ntlafatsa ho nepahala ha tlhophiso bakeng sa ho seha ka nepo, -ho sebetsa ka mokhoa o monyane, le tlhahiso e ikemetseng.


Khokahano ea Automation:Ts'ehetso ea ho kenya le ho laolla ka bohona, ho ts'oara liroboto, lits'ebetso tsa conveyor, puisano ea MES, le tlhahlobo ea inline.

 

Taolo ea Boleng

 

Mochini o mong le o mong oa Ceramic Substrate Laser Cutting o etsoa tlas'a tsamaiso e thata ea boleng ho netefatsa ho nepahala, botsitso, le ts'ebetso ea nako e telele-ea indasteri.

 

Likarolo tsa Premium Indasteri:Re khetha{{0}mehloli ea boleng bo holimo ea laser, li-optical components, linear motors, motion controller, le litsamaiso tse nepahetseng tsa tataiso ho netefatsa ts'ebetso e tšepahalang.


Kopano e nepahetseng:Mochini o mong le o mong o bokelloa mme o lokisoa ke baenjiniere ba nang le boiphihlelo ho fihlela boemo bo nepahetseng ba maemo le ho tsitsa.


Netefatso ea ho Seha Mohlala:Lisebelisoa tsa bareki kapa lisampole tse tloaelehileng tsa ceramic li ka sebetsoa pele li romelloa ho netefatsa boleng ba ho itšeha, pheletso ea moeli, ho nepahala ha sebopeho, le ts'ebetso e sebetsang hantle.


Teko ea Kamohelo ea Feme (FAT):Bareki ba amohelehile ho nka karolo Tekong ea Kamohelo ea Feme ea sebakeng sa marang-rang kapa e hole ho lekola tlhophiso ea mochini, ts'ebetso ea ho itšeha, le mesebetsi ea software pele e tlisoa.

 

Matla a Khampani

 

Shenzhen Chinasky Laser Technology Co., Ltd. e thehilweng ka 2004, ke khwebo ya naha-ea theknoloji e phahameng e sebetsanang le disebediswa tse bohlale tsa laser le{4}}metjhini e tlwaelehileng e itirisang e felletseng. Khamphani e na le sehlopha sa R&D sa profeshenale, tlhahiso, thekiso, le sehlopha sa litšebeletso tsa botekgeniki, se nang le lihlahisoa tse romelloang linaheng tse fetang 100 le libaka lefatšeng ka bophara.

 

Ka 2016, khamphani e ile ea amoheloa e le National High-Tech Enterprise 'me e fumane ka tatelano litifikeiti tse ngata tsa machaba tse nang le bolaoli tse kenyeletsang EU CE, FDA, le ISO 9001 Quality Management System. E na le litokelo tse 4 tsa boiqapelo ba naha le lipatente tse fetang 20 tsa mofuta oa utility. Kaha e ikemiselitse ho ntlafatsa{7}}ka nts'etsopele, k'hamphani e thehile litsamaiso tsa tlhahiso le lits'ebeletso tsa machaba tse tsamaellanang le tsa machaba, tse nang le marangrang a lits'ebeletso a thehiloeng libakeng tse ngata tsa China. Re fana ka bareki ba lehae le ba machabeng ka-litharollo tse le 'ngoe tse amanang le khetho ea ts'ebetso, thomello ea lisebelisoa, ho kenya le ho fana ka tumello, le ka mor'a{10}litlhokomelo tsa thekiso.

 

E Tšeptjoa ke Baetapele ba Liindasteri Lefatšeng ka Bophara

 

Ka lilemo tse fetang 20, Chinasky Laser e 'nile ea tšeptjoa ke bahlahisi ba ka sehloohong ho pholletsa le likoloi, sefofane, lisebelisoa tsa elektroniki, ts'ireletso, boenjiniere bo nepahetseng, le lisebelisoa tsa indasteri{1}tse li thusang ho ntlafatsa ts'ebetso e ntle, ho lelefatsa nako ea bophelo ba lisebelisoa, le ho fumana boleng bo holimo ba tlhahiso.

 

Sefofane le Tšireletso:E fanoe ho China Aerospace Science and Technology Corporation (CASC), AVIC Xi'an Aircraft (XAC), le China State Shipbuilding Industry Corporation (CSIC), moo boleng ba tjheseletsa, ho nepahala ha dimensional, le ho tšepahala ho leng bohlokoa.


Ho Etsa Likoloi:Ho sebeletsa Sehlopha sa FAW, BYD Auto, Dongfeng Motor, le Valeo bakeng sa tlhahiso ea likarolo tsa likoloi, tokiso ea lisebelisoa, welding e nepahetseng, tlhahiso ea betri le tlhahiso e bohlale.


Tlhahiso ea Elektronike le e Nepahetseng:E ts'ehetsa BOE Technology, Sunlord Electronics, le Sunwoda Energy e nang le-litharollo tsa laser tse nepahetseng haholo bakeng sa likarolo tsa elektroniki, hardware e nepahetseng, tlhahiso ea libeteri, le tlhahiso e tsoetseng pele ea indasteri.


Tlhahiso ea Liindasteri:Ho fana ka lisebelisoa tsa laser tse ikhethileng ho Sehlopha sa China Zhenhua, Kaizhong Precision Technology, le Galanz ho ntlafatsa ts'ebetso, ho fokotsa litšenyehelo tsa tlhokomelo, le ho ntlafatsa boleng ba sehlahisoa.


Mabenyane le Precision Metal Processing:Ho fana ka mahlale a laser a nepahetseng ho Chow Tai Fook bakeng sa-sebelisoa sa tšepe ea boleng bo holimo, welding e ntle, le tlhahiso e nepahetseng e hlokang ho nepahala le boleng bo holimo.

 

Packaging & Delivery

 

Mochini o mong le o mong oa Ceramic Substrate Laser Cutting o phuthetsoe ka botsebi ho netefatsa lipalangoang tse bolokehileng le ho kenya kapele lefatšeng ka bophara.

Thepa Sephutheloana:

Ho phuthela{0}mongolla
Tšireletso e khahlanong le{0}mafome
-mokokotlo o sa tsitsang
Linyeoe tse matlafalitsoeng tsa plywood tsa kantle ho naha
Sireletsa ho lokisa ka hare

Likhetho tsa ho Romela:

Meroho ea Leoatleng
Thepa ea Lifofane
Lipalangoang tsa Terene

Romella Litokomane:

Setlankana sa litefiso
Lenane la ho paka
Bill of Lading / Air Waybill
Setifikeiti sa Tšimoloho

 

Setifikeiti le Boikamahanyo

 

Mekhoa ea rona ea tlhahiso le meralo ea mochini e ntlafatsoa ho fihlela litekanyetso tsa boleng tse tsebahalang lefatšeng ka bophara le ho ts'ehetsa litlhoko tsa bareki mebarakeng ea lefats'e.

  • Setifikeiti sa High{0}}Tech Enterprise
  • ISO 9001
  • FDA
  • Setifikeiti sa Patent sa Mohlala oa Tšebeliso
  • CE

 

LBH

 

P: Ke lisebelisoa life tsa ceramic tseo mochine ona o ka li etsang?

A: E loketse alumina (Al₂O₃), aluminium nitride (AlN), zirconia (ZrO₂), silicon nitride (Si₃N₄), DBC, DPC, AMB ceramic substrates, le lisebelisoa tse ling tse tsoetseng pele tsa ceramic.

P: Melemo ea ho itšeha ka laser ke efe ha e bapisoa le ho itšeha ka mochini?

K: Laser cutting ke mokhoa oo e seng{0}}mokhoa oa ho ikopanya o fokotsang ho penya, o felisang ho roala ha lisebelisoa, o fokotsa khatello ea kelello, 'me o fana ka lintlha tse nepahetseng haholoanyane bakeng sa lisebelisoa tsa ceramic tse senyehang habonolo.

P: Na mochini o ka sebetsa-likarolo tse tšesaane tsa ceramic?

A: Ho joalo. Ka liparamente tsa laser tse ntlafalitsoeng le taolo e nepahetseng ea motsamao, sistimi e ka sebetsana le li-substrates tse tšesaane tsa ceramic ha e ntse e boloka boleng bo holimo le ho nepahala ha boholo.

P: Na mochine o tšehetsa litlaleho tse rarahaneng?

A: Ho joalo. E ka seha likoti tse nyane-ka nepo, li-slots, li-curved contours, libopeho tse sa tloaelehang, le lipaterone tse ikhethileng tse hlokehang bakeng sa likarolo tse tsoetseng pele tsa elektroniki.

P: Na mochine o ka kenngoa moleng oa tlhahiso o ikemetseng?

A: Ho joalo. E ts'ehetsa ho kenya liroboto, boemo ba pono ba CCD, lits'ebetso tsa conveyor, khokahano ea MES, le tlhahlobo ea boleng ba inline.

P: O fana ka litšebeletso tsa ho itšeha mohlala?

A: Ho joalo. Bareki ba ka romella lisampole tsa ceramic kapa litšoantšo bakeng sa tlhahlobo ea mahala ea ho itšeha ho netefatsa boleng ba ts'ebetso pele ba kenya odara.

P: Nako e tloaelehileng ea ho etella pele ke efe?

A: Mechini e tloaelehileng hangata e tlisoa nakong ea matsatsi a 20-30 a ts'ebetso, athe litsamaiso tse ikhethileng tsa tlhahiso li ka hloka nako e eketsehileng ho latela lintlha tsa projeke.

P: MOQ ea hau ke eng?

K: Re ts'ehetsa ho reka-mochini o le mong le merero e felletseng ea tlhahiso, e lumellang bareki ho lekola lisebelisoa pele ho matsete a maholo-.

P: U fana ka tiisetso efe?

K: Re fana ka tiisetso ea mochini oa likhoeli tse 24-mmoho le tšehetso ea bophelo bohle le likarolo tse ling tsa nako e telele.

P: Nka fumana khotheishene joang?

A: Ka kopo fana ka mofuta oa hau oa thepa ea ceramic, litekanyo tsa substrate, botenya, litlhoko tsa ho itšeha, bophahamo ba tlhahiso, le naha eo u eang ho eona. Baenjiniere ba rona ba tla khothaletsa tlhophiso e nepahetseng ka ho fetesisa mme ba fane ka khotheishene e felletseng nakong ea lihora tse 24.

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